专注于真空薄膜领域 Ion Sputtering System 离子源溅射设备 Ion E-beam System 离子源辅助蒸发系统 Ion Co Sputtering System 离子辅助溅镀设备 Ion Evaporator System 离子源辅助蒸发系统 Ion Etching system 离子源刻蚀设备 Customer Design System 支持客户自定义薄膜系统
Ion Beam Sputter Deposition 双离子源溅射系统
3 cm 离子源 5cm 离子源 12cm 离子源
系统采用世界知名公司离子源
设备结构示意图:
Ion Beam Sputter Deposition Ion Beam Sputter Deposition (IBSD) Reactive Ion Beam Sputter Deposition (RIBSD) Ion BeamSputterDeposition (IBSD)
© High-End Thin Film Deposition Process © Lower Pressure Sputter Deposition (10-4 Torr), Sputtered Atoms Retain Kinetic Energy Due to Minimal Scatting in Low Pressure Environments © High Quality, Smooth, Pin Hole Free Films © Enhanced Adhesion and Micro-structure Control © Yields Excellent Coverage at Small Thicknesses and on High Aspect Ratio Features © Independent Control of Ion Beam Parameters Allows User to Engineer Film for Desired Properties © Low energy ion assist with end-Hall ion sources © Typically, Film Properties from Ion Beam Deposition Exceed those Deposited by Evaporation or Magnetron Sputtering
Ion BeamSputterDeposition Applications Device / Process Materials Superconductors YBaCuOx, LaSrTiOx Thin Film Heads NiFe, CrCo Optical Thin Films Al2O3, Ta2O5, TiO2, SiO2 Ring Laser Gyro Mirrors Multilayer SiO2/TiO2 Dielectric Films SiO2, TiO2, AlN, etc. Encapsulation Films Si3N4, Al2O3 Anti-reflection Coatings MgF2, SiO2, Ta2O5, TiO2 Interconnect Films W, Au, Cu Sensors Composites or Alloys Advanced Magnetic Heads NiFe, Ta, Cu, Co, FeMn Semiconductor Si3N4, DLC X-ray Optics W, Cu, Mo, Si, B4C, Ni, C Laser Facets Si3N4, SiO2, Al2O3, Si High Reflectance Mirrors Refractory Oxides, Si Divisional Wave Multiplexers Refractory Oxides, Si Laser coatings Nb2O5, Ta2O5, HfO2, SiO2
详细信息请联系: 电话: 86-10-87721612,87721672 传真: 86-10-87721672 tom@hacori.com,何先生 |